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課程名稱 |
晶片系統封裝
System in Package |
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開課學期 |
105-2 |
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授課對象 |
電機資訊學院 電信工程學研究所 |
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授課教師 |
盧信嘉 |
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課號 |
EEE5025 |
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課程識別碼 |
943 U0270 |
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班次 |
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學分 |
3.0 |
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全/半年 |
半年 |
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必/選修 |
選修 |
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上課時間 |
星期二7,8,9(14:20~17:20) |
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上課地點 |
電二106 |
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備註 |
人數限50人。
總人數上限：50人 |
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Ceiba 課程網頁 |
http://ceiba.ntu.edu.tw/1052SIP |
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課程簡介影片 |
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核心能力關聯 |
核心能力與課程規劃關聯圖 |
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課程大綱
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課程概述 |
Scopes: Semiconductor IC Packaging/Testing/Assembly/Reliability Basics, Substrates for Embedded Passives, Electrical/Thermal/Stress Analysis, Applications of System in Package..
Contents:
1. Introduction to electronic packaging
2. Flip-chip, stacked, 3D packages, CBGA (ceramic ball grid array) and CCGA (ceramic column grid array)
3. Technology trend of advanced semiconductor packaging
4. Electrical design/analysis of system in package
5. Thermal/Stress analysis of system in package
6. Testing/Reliability of system in package
7. IPD (Integrated Passive Devices)
8. Applications of system in package |
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課程目標 |
Understand different materials and processing flows for package manufacturing.
Design of electronics packaging.
Understand thermal and reliability issues in package. |
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課程要求 |
Prerequisites: (recommended but not required)
Integrated circuit design, analog integrated circuit design
Spice or similar circuit simulator is required to do some simulation home works in this course. |
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預期每週課後學習時數 |
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Office Hours |
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指定閱讀 |
教科書： Richard K. Ulrich and William D. Brown, “Advanced Electronic Packaging” 2/e, IEEE Wiley-interscience, 2006
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參考書目 |
參考書目：
1. Fundamentals of Microsystems Packaging by R.R. Tummala, McGraw Hill, 2001
2. Integrated Passive Component Technology, by R.K. Ulrich and L.W. Schaper,
Wiley, 2003.
3. 邱碧秀，”微統封裝原理與應用,” 滄海書局, 2005
4. Introduction to System-on-package, by R.R. Tummala, McGraw Hill, 2008 華通書
坊
5. Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits
edited by Duixian Liu, Ulrich Pfeiffer, Janusz Grzyb, Brian Gaucher, Wiley,
2009
6. Electrical Modeling and Design for 3D System Integration: 3D Integrated
Circuits and Packaging, Signal Integrity, Power Integrity and EMC by Er-Ping
Li, Wiley, 2012.
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評量方式
(僅供參考) |
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No. |
項目 |
百分比 |
說明 |
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1. |
Homework |
20% |
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2. |
Mini-project |
20% |
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3. |
Mid-term exam |
30% |
in-class, open-book, open-note only |
4. |
Final exam |
30% |
in-class, open-book, open-note only |
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週次 |
日期 |
單元主題 |
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第1週 |
2/21 |
SiP overview / Introduction  |
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第2週 |
2/28 |
和平紀念日 放假一天 |
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第3週 |
3/07 |
Material and processing technologies for packaging  |
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第4週 |
3/14 |
Organic material/ Ceramic |
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第5週 |
3/21 |
Ceramic material / Electrical design |
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第6週 |
3/28 |
Electrical design |
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第7週 |
4/04 |
兒童節及民族掃墓節(放假日) |
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第8週 |
4/11 |
Thermal considerations  |
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第9週 |
4/18 |
期中考 |
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第10週 |
4/25 |
Discrete and embedded
passives  |
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第11週 |
5/02 |
Integrated Inductors  |
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第12週 |
5/09 |
Basic IC assembly |
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第13週 |
5/16 |
Basic IC assembly /Reliability |
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第14週 |
5/23 |
Reliability/ RF SoP |
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第15週 |
5/30 |
端午節 放假一天 |
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第16週 |
6/06 |
老師出國 停課一次  |
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第17週 |
6/13 |
RF SoP |
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第18週 |
6/20 |
Mini­project presentation |
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第19週 |
6/27 |
期末考 |
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